[Electronics] 3D structural analysis of a 128-layer 3D NAND flash memory

470 serial cross-sectional SEM images of a 128-layer 3D NAND flash memory were acquired on an orthogonally arranged FIB-SEM in 16 hours. The BSE images were taken at 1 kV accelerating voltage to obtain compositional contrast with minimum depth information. Reconstructed 3D data set allows extraction of arbitrary slice planes and subsequent geometrical & dimensional evaluation of channel holes.
#3DNAND #FlashMemory #128Layer #FIB #SEM #FIBSEM #electronmicroscopy #ElectronMicroscope
Available instruments for this measurement are :
Orthogonally arranged FIB-SEM
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