Hello Professor Teman, what is the reason behind placing the power-hungry macros away from the chip center for wire bond in the slide on Hard Macro Placement. What role does position have in the therma aspect? Whats the relation to the wire bond? Does it matter if it is a BGA?
Hello Professor Teman, what is the reason behind placing the power-hungry macros away from the chip center for wire bond in the slide on Hard Macro Placement. What role does position have in the therma aspect? Whats the relation to the wire bond? Does it matter if it is a BGA?
What might be the use of a routing blockage?