Loomia Technologies | Integration Techniques for Electronic Textiles: Bridging Hard & Soft Materials

Поделиться
HTML-код
  • Опубликовано: 15 сен 2024
  • Madison Maxey
    Explore practical integration strategies for seamlessly incorporating the Loomia Electronic Layer - a type of E-textile- into various fabrics, trims, and plastics. Delve into the nuanced considerations of each method, with a focus on understanding their advantages, limitations, and ideal applications. This session aims to equip attendees with the knowledge needed to effectively scale electronic integration within trims, providing valuable insights for product developers working at the intersection of rigid and flexible materials. From automotive PU leathers to performance fabrics for AR/VR, this discussion offers practical guidance for navigating the challenges of integrating electronics into textiles and sheet materials.
    ---------------
    To watch this presentation in full, please purchase
    TechBlick Annual Pass at www.techblick.... and login to
    TechBlick platform app.swapcard.c...
    View more presentations like this on:
    www.techblick....
    / @techblick
    Upcoming Events:
    www.techblick....
    The Future of Electronics RESHAPED Global:
    www.techblick....
    www.techblick....

Комментарии •