I use de-soldering wick to remove all the solder and then just pull the device out. To keep things clean I go arround 350 degrees celsius. Never damaged a board ever.
This is another technique that can be used. It can save on time especially if you have a thick board or one with several ground plans that can cause normal through hole desoldering issues. Sorry for the mislabeling of the videostream it is a DIP not an SOIC. I am glad that you noticed that and are paying attention to detail.
Solder wick for thru-hole is not recommended. Reason being is one you have solder wick that takes up a lot of your heat source plus the solder and then if you have a ground you will need more heat. To many variables and more chances of causing damage.
"SOIC Through-Hole" is a contradiction in terms!! That was a DIP (Dual Inline Package)through-hole IC. SOIC (Small Outline Integrated Circuit) refers to surface mount technology. Your method seems like a sloppy waste of time. You already have a nice desoldering tool, so why use the tweezers to remove the IC and then go back and suck all the solder out? Just suck the solder out first and avoid the mess you made!
Great tools. I've made such a new doing 1 by one.. looking for an air gun and chip removal solder
I use de-soldering wick to remove all the solder and then just pull the device out. To keep things clean I go arround 350 degrees celsius. Never damaged a board ever.
This is another technique that can be used. It can save on time especially if you have a thick board or one with several ground plans that can cause normal through hole desoldering issues. Sorry for the mislabeling of the videostream it is a DIP not an SOIC. I am glad that you noticed that and are paying attention to detail.
Do you recommend the PACE MBT 250A soldering station? What station you would recommend?
@yanava Hi How do you successfully use desoldering wick when you want to remove 40 DIP IC from PCB? Any info please Bye
Hi
Where can i get this type of iron please ?
I cant find one anywhere
Thanks
Solder wick for thru-hole is not recommended. Reason being is one you have solder wick that takes up a lot of your heat source plus the solder and then if you have a ground you will need more heat. To many variables and more chances of causing damage.
Nor recommended. If you use solder wick you have a great chance of causing damage to the board.
"SOIC Through-Hole" is a contradiction in terms!! That was a DIP (Dual Inline Package)through-hole IC. SOIC (Small Outline Integrated Circuit) refers to surface mount technology.
Your method seems like a sloppy waste of time. You already have a nice desoldering tool, so why use the tweezers to remove the IC and then go back and suck all the solder out? Just suck the solder out first and avoid the mess you made!