whole wafer cleaving with LG tools

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  • Опубликовано: 3 дек 2024
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Комментарии • 9

  • @ilkov
    @ilkov 2 года назад

    what's the difference between the different scriber? Do each of them have a different application or are they equivalent?

  • @UnbelievablyGauche
    @UnbelievablyGauche 3 года назад +1

    When the wafers are being made, we’ve all seen how they must be done in dust free environments.
    Now that the wafer has been finished, is there no concern about dust anymore?

    • @eXpG_Harlock
      @eXpG_Harlock 2 года назад

      nope there wont be any processes that could be disrupted by the dust.

    • @satrandhawadtm8115
      @satrandhawadtm8115 2 года назад

      There is always a concern about contamination.

    • @eXpG_Harlock
      @eXpG_Harlock 2 года назад

      Not in backend the regular methods of parting wafers are: sawing with a diamond saw, laser cutting, or this method. Sure in industry they tend to do it as clean as possible but after that the chip cant be destroyed by just some dust. For example the bonding process can be disrupted by dust yet the wafers can be easy cleaned with a nitrogen or via wiping with acetone. The most probematic processes in production are the cvd and lithography processes.

  • @bloguetronica
    @bloguetronica 4 года назад

    I wouldn't have the nerves to do this. One wrong move, and whole dies can be broken in half. Anyway, nice demo!

    • @eXpG_Harlock
      @eXpG_Harlock 2 года назад

      Wafers are not as fragile as they look. In this process, breaking is only so easy because of the scored edges.
      By the way, the whole thing works because of the alignment of the silicon grid.
      Of cource the wafers are to be handled with care anyways.

  • @romanibukharst9517
    @romanibukharst9517 6 лет назад

    thanks

  • @test8251
    @test8251 4 года назад

    Visit order.universitywafer.com for all your silicon wafer needs!
    Have a tough question? Ask us! Our engineers are waiting you!