Data Recovery Mission: Swapping the iPhone 13 Mini AP Board - Success or Failure?

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  • Опубликовано: 18 дек 2024

Комментарии • 14

  • @AmanSingh-pe8ze
    @AmanSingh-pe8ze 10 месяцев назад +1

    Sukhi Paji ❤

  • @Oprafoun
    @Oprafoun 10 месяцев назад +1

    Hi from CZ 😊 like your videos

  • @lucasszeyk3718
    @lucasszeyk3718 10 месяцев назад +1

    👍 nice job keep going , greetings

  • @sudheerm.s6792
    @sudheerm.s6792 10 месяцев назад +1

    Great ❤

  • @XTR_VISHU_GAMING
    @XTR_VISHU_GAMING 10 месяцев назад +1

  • @intouchrepair
    @intouchrepair 10 месяцев назад

    Sir kabhi kabhi a14 cpu me beech ke ped nikl jate h iska koi solution

    • @PhoneRepairTips
      @PhoneRepairTips  10 месяцев назад +1

      BRO THATS NOT ALWAYS YOUR FAULT EVEN SOMETIMES I GET THAT ITS WHEN MOBILE IS DROPPED VERY BADLY OR SOMEONE ELSE OVER HEAT PCB

  • @OmarCG-j8i
    @OmarCG-j8i 3 месяца назад

    Does iPhone 13 Mini factory middle layer use same temp as 12 Mini (low temp) or as 13 (high temp)

    • @PhoneRepairTips
      @PhoneRepairTips  3 месяца назад

      yes same

    • @OmarCG-j8i
      @OmarCG-j8i 3 месяца назад

      @@PhoneRepairTips same as what?

    • @PhoneRepairTips
      @PhoneRepairTips  3 месяца назад

      @@OmarCG-j8i same like you said high temp from 13 we use like 200 down and from up I use heat 280 with open nozzle to separate layer 12 mini use low melt no need to heat from up