Sub-Micron Sensor Assembly - FINEPLACER® sigma

The FINEPLACER® sigma combines sub-micron placement accuracy with a 450 x 300 mm2 working area and bonding forces up to 1000 N. The system is ideal for all types of precision die bonding and flip chip applications ready to ... READ MORE: eu.finetech.de/...
Tougher requirements related to the request for smaller, lighter and multi-functional electronic devices impose increased demands on IC packagings. Ever more complex circuitry, fine pitch and micro bump designs and die stacking are examples of how the industry meets these demands. Finding a suitable process technology for 3D packaging and reliably implementing it can be a challenge.
With a FINEPLACER(r) sigma, you can rely on a manual die bonder prepared for any packaging technology. This video shows the sub-micron placement and eutectic bonding process of a 20x20 mm² sensor chip. The device is characterized by high bump count (143,000), fine pitch (50 µm) and a small bump diameter (25 µm).