Innovations in AI Chip Packaging: Advanced Processes & Equipment Technologies

Presented by Aaron Fellis, Corporate Vice President, Lam Research
As artificial intelligence (AI) continues to permeate diverse sectors, from autonomous vehicles to healthcare, there is increasing demand for more powerful and efficient AI chips. This has led to a paradigm shift, with a focus not only on the performance of AI chips but also on their packaging. As the demand for higher processing power and energy efficiency grows, advanced packaging becomes more essential to support these requirements, driving sophisticated processes and equipment technologies that can handle the complexity of packaging AI chips. The presentation will shed light on equipment innovations and packaging methodologies that are shaping the future of AI chip technology.