Solder Ball Placement - Wafer, BGA, Substrate, etc.
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- Опубликовано: 14 мар 2020
- WB300 - Solder Ball Placement
- Products: Wafer, BGA, Substrate, etc.
- Applications: from Prototyping to Serial Production
- Product Size: ≤ 300 mm / 12 inch Diameter
- Ball Diameter: ≥ 100 µm (smaller diameters on request)
- Throughput Time: ≥ 20 Products / hour
- Product Set-up: ≤ 30 min.
