Illustration of a Wire Bonding Process

The cartoon shows a wire bonding process from a bond pad on a chip to a lead of a package. The process is known as ball bonding. Many terms related to the process, such as loop height an wire length, are illustrated.

[@johnloviearnado6202]

thanks for the video it gives me the basic knowledge in wire bonding process that helps a lot in my job as technician.

[@BruceLee-ju1bx]

Thanks for the visual presentation.

[@jarren9878]

thanks for this video,.may i ask, can we reduce time for search pad and lead?

[@rakeshnaidu4953]

Hello thanks for the video..i have few queries regarding this.. What all wire sizes available in this technology using copper material and does current carrying capacity of this joint purely depends on cross section area of wire, then how much current does 0.38mm dia of copper wire can carry....It will be very helpful if u are able to answer my queries

[@nichthier8d239]

You know, I really wonder what kind of people are interested in wire bonding but can't calculate the resistance/load capacity of a copper wire

[@jarren9878]

50um cupper wire

[@lamgaming4049]

can you explain about nsop&golf ball bond problem in wirebond?

[@jarren9878]

your pad something not good

how to bonding with Au-Ag wire in image sensor

[@andreaskampfrath6480]

If there are any questions about wire bonding, I would recommend a seminar at a company in Berlin, Germany. There are also online seminars available, very competent.

[@boogerking7411]

How did the free air ball formed?

[@rickmanuzonnicdao6388]

Starts at 0.57
Free air ball formed after firing the wire tail using EFO.

[@thahiameen3796]

right bro its working EFO eletro flam off

[@jarren9878]

facing EFO small ball detected, fire level already check ok, but ball also ok, dont know why facing efo small bond

[@muhamadfatquniam5101]

K&S wire bonder