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TCME302 represents a new generation of high-speed smart card module adhesive packaging, packaging thickness measurement, and packaging appearance inspection system. 100% online control of the entire process, minimizing manual intervention and saving labor costs. The latest gluing program design of the 16 nozzle gluing head makes the gluing quality higher, easier to maintain, and thus achieves simpler operations. Compared with traditional UV gas discharge lamps, the curing unit configuration of PTCME302 significantly reduces the space occupied by the LED UV lamp, while increasing its power, resulting in higher production efficiency. To save factory labor costs and effectively control product quality, PTCME302 as a card personalization machine, is equipped with module packaging thickness detection units and module strip surface defect detection units.