- Видео 6
- Просмотров 15 414
Mohd Syahrin Amri Mohd Noh
Добавлен 19 окт 2011
Видео
Hairline adjustment procedures on Disco DAD3350 Sawing machine (after Blade setup activities done)
Просмотров 9472 года назад
Notes on Industrial Semiconductor Process
Blade setup procedures after Blade change activities on Disco Sawing DAD3350
Просмотров 3502 года назад
Notes on Industrial Semiconductor Process
Blade Replacement steps on Disco DAD3350 Sawing Machine
Просмотров 2,3 тыс.2 года назад
Notes on Industrial Semiconductor Process
BEEE 3814 Wafer Mounter and Wafer Sawing Process
Просмотров 11 тыс.4 года назад
Notes on Industrial Semiconductor Process
Hi Mohd we make dicing saw similar to Disco, compant name is HEYAN
Dear sir, Glad to see this video. It helped us a lot. Can you share the deeper maker password to us? Can get all function for free?
Dear Sir, Thank you very much for the clear explantion how to exchange the hub blade. Can you also make a video how to exchange a hubeless blade on this DAD3350 machine ? Thanks in advance
Can we saw silicon wafer with 25 RPM?
The best is to perform DOE. It depends on the cutting method you are using whether single cut or step cut or dual pass as well. In basic, higher blade RPM produce lower topside chipping but resulting to higher backside chipping. In wafer sawing, parameter it is not only blade RPM plays a role, feed speed, blade height, cutting method and different wafer material and structure on sawing street will provide you different result, thus DOE is require for your device to get the best chipping output. For chipping free activities you could refer to my paper "Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process".
Thanks for your feedback
Hello sir, I have a problem with cutting and I'm having trouble solving it. in fact the finish of the cut at the edge is clean because the gold (electrolyte) on the rear face folds. I tried changing the cutting depth as well as the feed speed but the problem still persists. Thanks for your feedback. Sincerely
Hello admin i have disco diamond blades around 600 pieces ZH05-SD300-N1-70-N1629 BB-PGY-C352 Iwant to sell them in cheap price
Dear Sir, Thank you for the nice explanation. I am working with DISCO DAG810 Silicon Grinder and found your video quite relevant. If possible, Pls add your contacts to the channel.
Hi bro chan explain.thanks for your information .how to change longuage in dicing machine...?
bro kerja dimana?
Melaka boss :)
Hi bro could please upload more videos about disco package saw
I do not have package saw in my place. The concept is the same. The only different is wafer saw using hub blade while package saw is using hubless blade.
Hi bro could u please upload the video about how to did bbd calibration. Thanks
Adjust light from7%-10% by screwing BBD the on wheel cover. Or you can call Disco expert to do. They have a BBD super expert and free to do it. Let the BBD sensor height repeatability within 0.001mm.
Is automatic cutting line control possible?
im afraid none at the moment. its being done manually after blade replacement.
Well explained sir, please witch parameter we must modified for reproduction of dual passe with a single blade. Thank you.
For chipping performance you can evaluate the first cut depth, Feedspeed and Blade RPM which suits your wafer performance.
hello sir, thank you for your feedback. in fact my problem is that I can't do the dual pass test as you explained. for example if I have to cut 10 lines on the 90 angle. it first does all 10 lines with a depth d1 which allows cutting only on the plate then it repeats the same operation on the lines already cut with a depth d2.
I would like to know how to adapt my program, so that the blade cuts a line with the two depths d1 then d2 before passing the next line. as explained in your video. Thanks for your feedback
Thank you so much dear Syahrin Amri for sharing this valuable information. Can you please comment about blade eccentricity? For good quality cutting, what should be the blade eccentricity and how we can reduce it ? Thank for your time.
jauh la cha
Do we also need to perform contact setup after replacement of dicing blade or non-contact setup is enough? Thank you.
NCS is enough. Contact Set Up are only used when chuck table are removed from the base or if theres a malfunction involving blade height.
sir can u speak louder? the machine is too loud and we cant hear sir clearly...
Tq Amni for the feedback. I will try to improve the recording n future
Thank you sir
Thanks Sir Ir Ts Mohd Syahrin Amri Mohd Noh for the sharing.
New experience for me
Well explained. Thank you sir.
👍🏼👍🏼👍🏼
Thankyou sir
Thank you sir.
thank you sir, good knowledge
Thank you sir for the knowledge
thank you sir
Thank you Sir
Thankyou sir.
sangat bagus!!💗
thank you sire very easy to understand
good explanation sir 🤓
Thank you for the explanation sir
Thank you sir for the information, good knowledge
Perhaps a new triangle processor architecture, which would increase the density per area and solve the problem of dei scaling in wafer manufacturing! No need to cut the wafer as it would be a single circular die with 25 mm diameter, increasing the capacity by increasing the size of the circular wafer die!
nice video. basically, there is a third technology: plasma dicing (dicing by etching)
Tq ..I didnt get the chance to use the plasma dicing. Thanks for sharing the info.
Nowadays, companies don't use wafer sawing machines, They prefer Lazer machines as I know, but I got a job which position is sawing part of semiconductor about battery . COULD you give me some advice about this job it is good or not for my Career??
laser sawing is expensive and some company will use only on critical device. I did published some paper on using laser sawing combine with mechanical dicing to eliminate the chipping touching on active area for 60um saw street. Sawing is an intresting process and I really enjoyed it. Hope you enjoy your job as well.
Thank you
Well explained sir... thank you very much for ur effort sir...
Done. Thank you sir
Sama2
done, tq sir
👍
Done. Thank you sir
Done. Thank you sir
Thank you, Sir.
Rindunya nk pegang wafer😣😢
Done. Thank you sir
Thanks n very good information 👍
Thankyou and done
Good information