- Видео 13
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UCIe Consortium
Добавлен 21 фев 2023
The UCIe Consortium is an industry consortium dedicated to advancing UCIe™ (Universal Chiplet Interconnect Express™) technology, an open industry standard that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. UCIe Consortium is led by key industry leaders
Advanced Semiconductor Engineering, Inc. (ASE), Alibaba, AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, NVIDIA, Qualcomm Incorporated, Samsung Electronics, and Taiwan Semiconductor Manufacturing Company. For more information, visit www.UCIexpress.org.
Advanced Semiconductor Engineering, Inc. (ASE), Alibaba, AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, NVIDIA, Qualcomm Incorporated, Samsung Electronics, and Taiwan Semiconductor Manufacturing Company. For more information, visit www.UCIexpress.org.
A Deep Dive into UCIe-3D
With increasing demands for higher performance, bandwidth density, and power efficiency the industry is rapidly adopting 2.5D and 3D packaging technologies to address these challenges. This shift highlights the pressing need for a unified industry ecosystem standard-one that provides a standardized architecture for streamlined manageability and addresses the unique design complexities of advanced packaging. The UCIe 2.0 specification supports 3D packaging - offering higher bandwidth density and improved power efficiency compared to 2D and 2.5D architectures.
Join us in this webinar as we dive into the benefits of UCIe-3D including its hybrid bonding optimization, flexible bump pitch adapta...
Join us in this webinar as we dive into the benefits of UCIe-3D including its hybrid bonding optimization, flexible bump pitch adapta...
Просмотров: 761
Видео
Introducing the UCIe 2.0 Specification Supporting 3D Packaging and Manageability System Architecture
Просмотров 1,9 тыс.3 месяца назад
The UCIe™ (Universal Chiplet Interconnect Express™) 2.0 Specification was released in August 2024, adding support for a standardized system architecture for manageability and holistically addresses the design challenges for testability, manageability, and debug (DFx) for the SIP lifecycle across multiple chiplets - from sort to management in the field. The webinar explores the new features in t...
Exploring the Advancement of Chiplet Technology and the Ecosystem
Просмотров 1,5 тыс.8 месяцев назад
Semiconductor companies are making transistors smaller and cramming more into chips to meet the demands of today’s high-tech industries and applications. In fact, in a recent article from the Financial Times, technology industry consultants McKinsey forecast that semiconductors will become a trillion-dollar industry by the end of this decade. Even with this massive growth, manufacturers recogni...
Explore the usage models for UCIe technology - FMS 2023
Просмотров 1 тыс.Год назад
UCIe (Universal Chiplet Interconnect Express) addresses customer requests for a more customizable, package-level integration combining best-in-class die-to-die interconnect and protocol connections from an interoperable, multi-vendor ecosystem. UCIe supports two broad usage models. The first is a package level integration to deliver power-efficient and cost-effective performance. The second is ...
UCIe Manageability and Software - FMS 2023
Просмотров 533Год назад
Founded in 2022, the UCIe Consortium is an industry Consortium dedicated to advancing UCIe (Universal Chiplet Interconnect Express) technology an open industry standard that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. The UCIe 1.0 specification provides a complete standardized die-to-die interco...
UCIe Protocol Overview - FMS 2023
Просмотров 1,9 тыс.Год назад
This presentation provides an overview of the different layers of the UCIe stack, covering the functionality split between the different layers. Link protocol will be covered including main-band and sideband transfers, Link training, as well as a summary of supported Protocol mappings (PCIe/CXL/Streaming) and the corresponding Flit formats. Learn more: www.uciexpress.org
Introduction to UCIe Tutorial: Software Manageability & Compliance
Просмотров 866Год назад
High-performance and power efficiency needs of emerging workloads demand on-package integration of heterogeneous processing units, memory, and electrical and optical interconnects. Applications such as artificial intelligence, machine learning, data analytics, 5G, automotive, and high-performance computing are driving these demands to meet the needs of cloud computing, intelligent edge, enterpr...
Introduction to UCIe Tutorial: UCIe Protocols
Просмотров 6 тыс.Год назад
High-performance and power efficiency needs of emerging workloads demand on-package integration of heterogeneous processing units, memory, and electrical and optical interconnects. Applications such as artificial intelligence, machine learning, data analytics, 5G, automotive, and high-performance computing are driving these demands to meet the needs of cloud computing, intelligent edge, enterpr...
Introduction to UCIe Tutorial: Electrical, Form Factor, and Compliance
Просмотров 1,9 тыс.Год назад
High-performance and power efficiency needs of emerging workloads demand on-package integration of heterogeneous processing units, memory, and electrical and optical interconnects. Applications such as artificial intelligence, machine learning, data analytics, 5G, automotive, and high-performance computing are driving these demands to meet the needs of cloud computing, intelligent edge, enterpr...
Introduction to UCIe Tutorial: Overview
Просмотров 4,4 тыс.Год назад
High-performance and power efficiency needs of emerging workloads demand on-package integration of heterogeneous processing units, memory, and electrical and optical interconnects. Applications such as artificial intelligence, machine learning, data analytics, 5G, automotive, and high-performance computing are driving these demands to meet the needs of cloud computing, intelligent edge, enterpr...
The UCIe™ 1.1 Specification: Future Applications of Chiplets Webinar
Просмотров 3 тыс.Год назад
The UCIe™ (Universal Chiplet Interconnect Express™) 1.1 Specification was released in August 2023, delivering valuable improvements to the chiplet ecosystem, extending reliability mechanisms to more protocols and supporting broader usage models. This webinar provides an overview of enhancements made in the UCIe 1.1 specification and architectural specification attributes to define system setups...
UCIe™ Packaging Technologies Webinar
Просмотров 4,7 тыс.Год назад
UCIe™ (Universal Chiplet Interconnect Express™) is an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. UCIe technology offers flexibility for integration across multiple packaging technologies. The webinar will cover standard laminate as well as advanced options such as silico...
Introduction to UCIe™
Просмотров 17 тыс.Год назад
UCIe™ - Universal Chiplet Interconnect Express™ - is an open industry standard founded by the leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers to address customer requests for more customizable package-level integration. The newly formed UCIe Consortium fosters an open chiplet ecosystem by offering high-bandwidth, low-latency, power-efficient, and cost-...
Highly Informative, Special thanks to the Dr.Debendra for giving us an excellent overview of UCIe.
remote control chip option has to be optional; I dont want to leave even a possibility for a third party to backdoor my comp even if its turned off.
How to handle the TLP CFG packets over mainband
i want the presentation
How to get UCIe protocol specification.
where we can get the specification for UCIe
Which Streaming Protocol should we support when designing UCIe Protocol Layer? Because there are many vendor streaming protocol such as AXI Streaming or CXS ...
It is generic it should support all the protocol.
Yess It support all of them whether it's vendor specific (like AMBA's protocol) or any of the user specific. Because above of the protocol layer one more hidden layer present called 'Translator' that extract the basic info from vendor specific protocol and then forwarded to Protocol layer.
@@amirsharfuHi, can you provide more information regarding this hidden layer. Because as far as I know I haven't encountered any such layer. For streaming protocol ucie just picks up the data and forwards it.
Good material to quick-know ucie
Hello, I enjoyed reading your article but I have a question? Will the frequency (lclk) on the RDI interface provided to the Adapter & PHY be fixed at 2GHz or variable to meet the bandwidth of 4-32GTs?
Hello, I enjoyed reading your article but I have a question? Will the frequency (lclk) on the RDI interface provided to the Adapter & PHY be fixed at 2GHz or variable to meet the bandwidth of 4-32GTs?
Very Informative.. Thanks!
Great webinar for full picture of packaging technologies. Thanks.
😞 P r o m o s m