Stealth dicing is a zero-waste, dry process which does not require any cleaning. Kerf width can be drasticly reduced. Stealth Laser can be applied to multi-project-wafers (MPW) or MEMS and various materials, as the dry process suits products which have to be protected from water or contamination. SD is a two-stage process. Firstly, the laser beam is focused in the inside of the workpiece creating a so-called modified layer/SD layer. Secondly, in order to separate the dies, external force is applied to singulate the dies along the modified layer.