Kelvin Thermal is the world leader in the development of Thermal Ground Planes (TGP), i.e. vapor chamber or 2-D flat heat pipe. Our TGP can be low-cost, thin (0.15 - 0.25mm), light (0.05 - 0.15 g/cm2), flexible (bending radius of 10 - 3mm) and large (100 - 1,000mm) for heat fluxes ranging from 1 to 1,000 W/cm2. TGP is an enabling cooling technology for smartphones, tablets, laptop PCs, ARs/VRs, other wearable electronics, GaN/SiC-based power electronics, battery packs in electric vehicles, and edge and cloud computing systems. TGPs with effective thermal conductivities ranging from 4,000 to 25,000 W/mK, reduce a system’s skin and junction temperatures with less dimensional design constraints than existing solutions using metal (200 to 400 W/mK), graphite (400 to 1,500 W/mK), heat pipes and traditional vapor chambers. Kelvin Thermal designs application-specific TGPs for customers. For any further information, submit your requests through our web site www.kelvinthermal.com/.