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Not really a practical microfabrication topic but this was just so amazing to image that it had to be shared. This is a sample of diatomaceous earth which you can buy at your local hardware store. It is composed of microscale glass exoskeletons that were built by algae millions of years ago. Not only is it stunning that these creatures can build up glass structures from environmental silicon bu...

Buckle up kids! Sit back and enjoy this electrifying review of the Trion Metal Etcher.

In another riveting installment, we show the first of two lithography steps used to make our germanium test structures. This step is used to pattern the germanium on a wafer with only two layers: silicon and germanium. In this project we were exploring germanium deposition using a number of sputtering and pulsed laser deposition techniques.

In this step, we oxidize the wafers immediately after the RCA clean. The oxidation is used to activate the two ion implants performed in a previous steps.

In this installment of the Bipolar Junction Saga, we perform an RCA clean on our wafers in preparation for an oxidation that activates the previous 2 ion implants. For more information, the written version of the SOP is found here: louisville.edu/micronano/files/documents/standard-operating-procedures/RCAclean_SOP.pdf Warning: This video is quite boring but is an important part of the fabricati...

Here we remove the photoresist after implant with an oxygen plasma in the reactive ion etcher. An oxygen plasma is used instead of solvent as the ion bombardment makes the photoresist hard to solvate.

Inspecting the photoresist for defects after the second ion implantation. Sometimes one will see cracks caused by the ions.

In the continuing saga of the germanium test device build, we etch the aluminum layer. This is the last lithography step and except for removing the resist, is the last step in the build.

For the germanium test structure build, in this step we develop photo resist after alignment and exposure. Since this is a CMOS process in a MEMS cleanroom, we have to take special precautions to prevent contamination of the devices.

The second near UV lithography step defining the aluminum electrodes on the germanium test wafer. We are building a simple set of test structures to allow probing the electrical characteristics of a 1.4 micrometer thick germanium layer deposited on a silicon wafer. The aluminum mask is aligned to features in the germanium layer.

A demonstration of photo-resist stripping on germanium coated 2-inch silicon wafers. We are building a simple set of test structures to allow probing the electrical characteristics of the germanium layer.

A descum step uses an oxygen plasma to briefly etch organics from the surface of a wafer after photolithography and development of the photo resist. The goal is make sure the areas without resist are nice and clean. This can be a particularly helpful step if an adhesion layer was used between the wafer and resist.

Part of a series to illustrate all the steps to making a prototype device in an academic clean room. The aluminum etch on these bipolar junction transistors is near the end of the fabrication sequence. The last couple of steps are to remove the photo-resist and anneal the metal.

From a wire bonding training session with Mr. Dan Haver of Sunshine Semiconductor (sunsemi.com/) at the University of Louisville. This video focuses on the principles and practicality of ultrasonic wedge bonding to microfabricated devices with gold and aluminum wire.

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