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Practical Microfabrication
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Добавлен 22 окт 2018
Tool Review #2 Lesker PVD 75
Thinking of buying a sputterer? Then this tool might be for you! This one gets an unequivocal thumbs up. Not sponsored, we just like it.
Просмотров: 272
Видео
Nanostructured Glass from Ancient Algae
Просмотров 89Год назад
Not really a practical microfabrication topic but this was just so amazing to image that it had to be shared. This is a sample of diatomaceous earth which you can buy at your local hardware store. It is composed of microscale glass exoskeletons that were built by algae millions of years ago. Not only is it stunning that these creatures can build up glass structures from environmental silicon bu...
Tool Review #1 Trion Metal Etcher
Просмотров 124Год назад
Buckle up kids! Sit back and enjoy this electrifying review of the Trion Metal Etcher.
Ge Lithography on Ge Test Structures Step 40
Просмотров 1512 года назад
In another riveting installment, we show the first of two lithography steps used to make our germanium test structures. This step is used to pattern the germanium on a wafer with only two layers: silicon and germanium. In this project we were exploring germanium deposition using a number of sputtering and pulsed laser deposition techniques.
BJT Step 250 Oxidation
Просмотров 833 года назад
In this step, we oxidize the wafers immediately after the RCA clean. The oxidation is used to activate the two ion implants performed in a previous steps.
BJT Step 240 RCA Clean
Просмотров 753 года назад
In this installment of the Bipolar Junction Saga, we perform an RCA clean on our wafers in preparation for an oxidation that activates the previous 2 ion implants. For more information, the written version of the SOP is found here: louisville.edu/micronano/files/documents/standard-operating-procedures/RCAclean_SOP.pdf Warning: This video is quite boring but is an important part of the fabricati...
BJT Step 230 Strip Resist After Implant
Просмотров 643 года назад
Here we remove the photoresist after implant with an oxygen plasma in the reactive ion etcher. An oxygen plasma is used instead of solvent as the ion bombardment makes the photoresist hard to solvate.
BJT Step 225 Inspection After 2nd Ion Implant
Просмотров 453 года назад
Inspecting the photoresist for defects after the second ion implantation. Sometimes one will see cracks caused by the ions.
CMOS Al Etch Ge Test Devices Step 180
Просмотров 1133 года назад
In the continuing saga of the germanium test device build, we etch the aluminum layer. This is the last lithography step and except for removing the resist, is the last step in the build.
CMOS Development on aluminum
Просмотров 853 года назад
For the germanium test structure build, in this step we develop photo resist after alignment and exposure. Since this is a CMOS process in a MEMS cleanroom, we have to take special precautions to prevent contamination of the devices.
Lithography with a Dash of Alignment
Просмотров 2933 года назад
The second near UV lithography step defining the aluminum electrodes on the germanium test wafer. We are building a simple set of test structures to allow probing the electrical characteristics of a 1.4 micrometer thick germanium layer deposited on a silicon wafer. The aluminum mask is aligned to features in the germanium layer.
Stripping Photo Resist CMOS Style
Просмотров 7153 года назад
A demonstration of photo-resist stripping on germanium coated 2-inch silicon wafers. We are building a simple set of test structures to allow probing the electrical characteristics of the germanium layer.
Building a light gated bipolar junction transistor. Step 500: Descumming the photo resist.
Просмотров 603 года назад
A descum step uses an oxygen plasma to briefly etch organics from the surface of a wafer after photolithography and development of the photo resist. The goal is make sure the areas without resist are nice and clean. This can be a particularly helpful step if an adhesion layer was used between the wafer and resist.
Building a light gated bipolar junction transistor. Step 510: Aluminum Etch
Просмотров 713 года назад
Part of a series to illustrate all the steps to making a prototype device in an academic clean room. The aluminum etch on these bipolar junction transistors is near the end of the fabrication sequence. The last couple of steps are to remove the photo-resist and anneal the metal.
The Mysterious Secrets of Wedge Bonding
Просмотров 19 тыс.4 года назад
From a wire bonding training session with Mr. Dan Haver of Sunshine Semiconductor (sunsemi.com/) at the University of Louisville. This video focuses on the principles and practicality of ultrasonic wedge bonding to microfabricated devices with gold and aluminum wire.
RIE Troubleshooting and Maintenance Part 2 - Fixed!
Просмотров 944 года назад
RIE Troubleshooting and Maintenance Part 2 - Fixed!
AFM Lab Training Part 3 Substrate Approach and Scanning
Просмотров 7175 лет назад
AFM Lab Training Part 3 Substrate Approach and Scanning
AFM Lab Training Part 2: Cantilivers and Mounting
Просмотров 6515 лет назад
AFM Lab Training Part 2: Cantilivers and Mounting
Atomic Force Microscopy Training from Asymum, Definitions and Introduction, Part 1
Просмотров 1,5 тыс.5 лет назад
Atomic Force Microscopy Training from Asymum, Definitions and Introduction, Part 1
RIE Troubleshooting and Maintenance Part1
Просмотров 2395 лет назад
RIE Troubleshooting and Maintenance Part1
The inner workings of a Kulicke & Soffa Ball Bonder
Просмотров 4,5 тыс.5 лет назад
The inner workings of a Kulicke & Soffa Ball Bonder