The exploding demands in compute-intensive workloads for the Internet of Things (IoT), Artificial Intelligence (AI) and Industry 4.0 create significant thermal challenges for data center operators. Net zero, sustainability and energy cost requirements add further pressures to come up with solutions.
Providers of liquid cooling solutions for data centers, from immersion cooling to direct-to-chip, have seen hyper growth adoption in the last year. New ceramic and compound semiconductor materials in chips and power electronics could also play a role in solving the thermal challenges in computing.
This webinar explores:
- Examples of emerging data center cooling approaches
- How waste heat from d...